Carultch
Senior Member
- Location
- Massachusetts
In a situation over 250V to ground, where you have ring KO's remaining, I understand that you need additional bonding means for raceway continuity to the enclosure. Bonding bushing, bonding locknut, or similar.
What if you don't need raceway continuity in your application, because of a wire EGC?
Example: it connects with no ring KO's to metal enclosure 1, and it connects with ring KO's to enclosure 2. There is an EGC from the ground bar of enclosure 1, that connects to enclosure 2, bypassing the need to rely on the raceway continuity for equipment bonding of the circuit. The raceway is already bonded to enclosure 1.
What if you don't need raceway continuity in your application, because of a wire EGC?
Example: it connects with no ring KO's to metal enclosure 1, and it connects with ring KO's to enclosure 2. There is an EGC from the ground bar of enclosure 1, that connects to enclosure 2, bypassing the need to rely on the raceway continuity for equipment bonding of the circuit. The raceway is already bonded to enclosure 1.