I have class 1 division 1 equipment that will use explosion proof enclosures and separate purged enclosures. NEC 501.30 states that article 250 is required, as well as 501.30(A) and (B).
The main power is fed into an explosion proof enclosure, where a period of time transpires before allowing the power to continue to the purged enclosure. Is there any reason that I would not bond the equipment grounding conductor directly from the terminal inside the explosion proof enclosure to the type X purged enclosure?
Is there any reason why the grounding/bonding process would be any different than if it were in an unclassified location? From 501.30, there does not appear to be any difference other than bushings and provisions for flexible metal conduit...
The main power is fed into an explosion proof enclosure, where a period of time transpires before allowing the power to continue to the purged enclosure. Is there any reason that I would not bond the equipment grounding conductor directly from the terminal inside the explosion proof enclosure to the type X purged enclosure?
Is there any reason why the grounding/bonding process would be any different than if it were in an unclassified location? From 501.30, there does not appear to be any difference other than bushings and provisions for flexible metal conduit...