2002 NEC 250.104(A)(4) I believe I understand the requirements of this article...but my understanding does not go along with the electrical inspector or engineer on this project.
My understanding: Separately derived system. The interior metal water piping in the area served by the SDS must be bonded to the grounded conductor of the SDS. Can be done 2 ways. #1 By running a bonding conductor from the metal water piping to the connection point of the grounding electrode conductor on the SDS. #2 By running a bonding conductor from the effectively grounded frame of the building, if the frame is used as the grounding electrode for the SDS, to the metal water piping that is in the area served by the SDS. These bonding conductors would be sized off of 250.66.
Their understanding: There is no need to bond the interior metal water piping in the area served by the SDS because the building water line is bonded to the building steel back at the main service.
Please clarify!
Thanks
My understanding: Separately derived system. The interior metal water piping in the area served by the SDS must be bonded to the grounded conductor of the SDS. Can be done 2 ways. #1 By running a bonding conductor from the metal water piping to the connection point of the grounding electrode conductor on the SDS. #2 By running a bonding conductor from the effectively grounded frame of the building, if the frame is used as the grounding electrode for the SDS, to the metal water piping that is in the area served by the SDS. These bonding conductors would be sized off of 250.66.
Their understanding: There is no need to bond the interior metal water piping in the area served by the SDS because the building water line is bonded to the building steel back at the main service.
Please clarify!
Thanks