250.104 Bonding other systems

Status
Not open for further replies.

marmathsen

Senior Member
Location
Seattle, Washington ...ish
Occupation
Electrical Contractor

In the thread above the OP mentions that their inspector allowed them to bond the gas from a subpanel. I have received the same suggestion from an inspector in the past. My inspector suggested and allowed me to bond not only the gas but also the hot water and waste as well.

My question is, how is this allowed? In looking at 250.104(B) the 5 allowed attachment points are:
(1) Equipment grounding conductor for the circuit that is likely to energize the piping system
(2) Service equipment enclosure
(3) Grounded conductor at the service
(4) Grounding electrode conductor, if of sufficient size
(5) One or more grounding electrodes used, if the grounding electrode conductor or bonding jumper to the grounding electrode is of sufficient size

Obviously item 1 above makes all the rest of them moot, which begs the question, why are the rest of them there? Even still I don't see how a separate bond wire can come from a sub panel since it's not in the list. Obviously if you run a bond wire from the same panel that the "circuit likely to energize the gas" comes from then I guess that's effectively OK but technically not allowed? But what if that circuit is run from the main service panel but the bond wire is run from a separate sub panel? Is it catastrophizing to think someone may remove that feeder in the future, thus disconnecting that bond wire. I guess that makes an argument for always running it back to the service.

I guess I'm asking:
1. How is it allowed to run the bond out of a subpanel?
2. Why are those 4 other items even there?
3. If you take it for granted that running from a subpanel is OK, then is that even wise, or should it always be run to the service?

Rob
 
IMO, it is not allowed by the NEC
The others could come into play if you have no appliance that has gas + a branch circuit such as a free standing heater.
 
Nothing prohibits an EGC from doing double duty as a bonding jumper, and I'm not aware of any requirements for a bonding jumper to be unspliced.

A subpanel is going to have an EGC that runs back to the service panel. If that EGC is at least as large as the required bonding jumper, then a bonding jumper coming out of that subpanel will satisfy 250.104(B)(2).

Cheers, Wayne
 
Status
Not open for further replies.
Top