Think carefully about what you are trying to accomplish and don't lose track of what an NEC section is about. 250.64 is about connecting the grounding electrode conductor to the system, system grounding, it is NOT about "grounding the wireway". Completely different things.If I ground the wireway per the option allowed on 250.64(D)(3), where would you start the EGC wire from?
Right from the wireway to the disconnects or from the disconnects to the panels or neither?
Please see picture below, thanks
Like rob said those need to be bonded either to the neutral or a bonding jumper or via a raceway with service bonding....but.....the section you mentioned is about connecting the grounding electrode conductor to the system (assuming we aren't talking about an ungrounded system). Different things.
I think the intended purpose of that graphic is to show the "common location" method of connecting a GEC to the grounded conductor of a service with multiple service disconnect enclosures. The other common method is the "tap" method where you tap off the GEC to each enclosure and land the tap on the grounded terminal bus in each service disconnect.I feel like I'm almost understanding it haha
Why do they show these Bonding SSBJ here then? (my understanding up to this point is that they wouldn't be needed)
picture:
