250.8(b)

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Twist87

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250.8 Connection of Grounding and Bonding Equipment
(B) Uses not permitted. Connection devices or fitting that depend solely on solder shall not be used.

Can anyone tell me the intent of this section? Is it to not allow a wire soldered to a metal enclosure? Does this not allow the use of Cannon or Amphenol connectors (that are not U.L. listed but do meet MIL 50515H) that use soldered pins?

Thanks,
Allen Keller
 
Twist87 said:
Can anyone tell me the intent of this section?
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I would imagine the concern is that heating of the connection can melt the solder. The code also says that soldered connections shall be made tight and firm before soldering.
 
LarryFine said:
I would imagine the concern is that heating of the connection can melt the solder. The code also says that soldered connections shall be made tight and firm before soldering.
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Right! The solder should not be the sole means making the connection, because the heating effect from the current, and any wire strain imposed could cause the solder to melt resulting in an even worse connection or no connection at all.

In an Amp. connector, I would think that the clamped/strain relief end of the plug provides protection from that as well.
 
Twist87 said:
250.8 Connection of Grounding and Bonding Equipment
(B) Uses not permitted. Connection devices or fitting that depend solely on solder shall not be used.

Can anyone tell me the intent of this section? Is it to not allow a wire soldered to a metal enclosure? Does this not allow the use of Cannon or Amphenol connectors (that are not U.L. listed but do meet MIL 50515H) that use soldered pins?

Thanks,
Allen Keller
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Allen,

The Mil-C-5015 is a Fed 'Listed' connector. Follow the Mil Standard specifications for Article 110.3 compliance. There are suitable crimp pin types that are more reliable than soldered connections. rbj
 
gndrod said:
The Mil-C-5015 is a Fed 'Listed' connector. Follow the Mil Standard specifications for Article 110.3 compliance. There are suitable crimp pin types that are more reliable than soldered connections. rbj
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Take a look at 250.126, that section would prevent the use of any Amphenol connectors I have seen, perhaps they make a version that does meet 250.126.
 
iwire said:
Take a look at 250.126, that section would prevent the use of any Amphenol connectors I have seen, perhaps they make a version that does meet 250.126.
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Bob,
I think I see what you are stating in 250.126, (the use of solder in a connector for making permitted methods exclusive of a soldered bond.) In using connector applications for making a ground between frame and harness, a locking shell that meets conductive bonding requirements for system grounding can apply.
The solder 'pin and socket' connector contacts are what I think the PO is referring to in a through-grounded conductor.

Twist87,
More explanation of what the 'intent' for the grounding application and circuit configuration will help.

rbj
 
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