Article 250 and bonding requirements of metal surfaces.

[Dale001289]

250.4(A) (1) thru (5) require equipment to be grounded/bonded in order to form an effective fault path. NEC also requires all grounding electrodes must be bonded together at the point of Service.
As standard industry practice we frequently bond metal surfaces such as panelboards, junction boxes, motor frames etc to the electrode system to eliminate differences of potential but where does it actually state in the Code this is a requirement?

 

[kwired]

250.4(A) (1) thru (5) require equipment to be grounded/bonded in order to form an effective fault. NEC also says all grounding electrodes must be bonded together at the point of Service.
As standard industry practice we frequently bond metal surfaces such as panelboards, junction boxes, motor frames etc to the electrode system to eliminate differences of potential but where does it actually state in the Code this is a requirement?

Those items you mentioned are already bonded to the grounding electrode system via the equipment grounding conductor ran to them.

There is no general requirement to run additional bonding conductors back to the grounding electrode system.

 

[Dale001289]

Those items you mentioned are already bonded to the grounding electrode system via the equipment grounding conductor ran to them.

There is no general requirement to run additional bonding conductors back to the grounding electrode system.

Thanks, Kwired.