Re: Bonding a pool
The purpose of the #8 equipotential bonding conductor,is to eleminate voltage gradients of the metalic part assoiated with the metalic pool parts,equipotental grid, and the local assoiated pool equipment only.
If you have a remote panelboard at a separate structure, local panel assoiated with this pool equipment remote from the SDS,Yes...
If fed from the SDS directly,path can be established by means of a properly sized and "Insulated" EGC,installed with circuit for equipment,to the EGC bonding path, from the SDS..Not in the need to extend the #8 solid cu to the SDS.
[ May 03, 2005, 08:25 PM: Message edited by: dillon3c ]
