Midcobrian
New member
- Location
- SD
Hello MH Experts
First off let me thank you for the opportunity to ask your NEC experts a question.
I can find multiple sources on the forum that refer to using an electrical enclosure as a possible bonding point for low voltage. Some broadband MSO's have used the air conditioning disconnect as a bonding point when no other means of bonding is present.
After the introduction of the ISBT as a required device, I am being told by other MSO's that the A/C disconnect enclosure is no longer permissible as a means of bonding when a ISBT is not present.
Within the scope of NEC 2014, is the air conditioning disconnect enclosure an acceptable bonding point if there is no ISBT or other means listed in 250.94 1-6?
Thank you
First off let me thank you for the opportunity to ask your NEC experts a question.
I can find multiple sources on the forum that refer to using an electrical enclosure as a possible bonding point for low voltage. Some broadband MSO's have used the air conditioning disconnect as a bonding point when no other means of bonding is present.
After the introduction of the ISBT as a required device, I am being told by other MSO's that the A/C disconnect enclosure is no longer permissible as a means of bonding when a ISBT is not present.
Within the scope of NEC 2014, is the air conditioning disconnect enclosure an acceptable bonding point if there is no ISBT or other means listed in 250.94 1-6?
Thank you