Bonding cold water if there is a Uffer Grnd

[27hillcrest]

Do you need to bond to the cold water pie system and jumper the meter if there is a uffer ground for the service? Note the cold water pipe from the street is plastic. The cold water in the building is copper.
TIA

 

[chris kennedy]

Still need to bond it as per 250.104(A).

 

[27hillcrest]

Is it still sized fro table 250-66

 

[Ponchik]

Bonding is different than using it as a grounding electrode. For bonding it doesn't have to be sized to 250.66. I would size it to largest circuit that MAY energize the water piping system and use table 250.122.

 

[dana1028]

Bonding is different than using it as a grounding electrode. For bonding it doesn't have to be sized to 250.66. I would size it to largest circuit that MAY energize the water piping system and use table 250.122.

That's not what 250.104(A)(1) says: "Metal water piping systems ...shall be 'bonded' to the svc equipment enclosure, the grounded conductor at the svc, the GEC where of sufficient size or to the one or more electrodes used. The 'bonding jumpers' shall be sized in accordance with T250.66.

No mention about 'may energize the water piping system.'

 

[Gregg Harris]

Do you need to bond to the cold water pie system and jumper the meter if there is a uffer ground for the service? Note the cold water pipe from the street is plastic. The cold water in the building is copper.
TIA

The meter would not require a bonding jumper, the water system is not being used as a grounding electrode, but the interior needs to be bonded as stated in 250.104 (A)

(B) Effective Grounding Path. The connection of a grounding electrode conductor or bonding jumper to a grounding electrode shall be made in a manner that will ensure an effective grounding path. Where necessary to ensure the grounding path for a metal piping system used as a grounding electrode, bonding shall be provided around insulated joints and around any equipment likely to be disconnected for repairs or replacement. Bonding jumpers shall be of sufficient length to permit removal of such equipment while retaining the integrity of the grounding path.

250.104 Bonding of Piping Systems and Exposed Structural Steel.
(A) Metal Water Piping. The metal water piping system shall be bonded as required in (A)(1), (A)(2), or (A)(3) of this section. The bonding jumper(s) shall be installed in accordance with 250.64(A), (B), and (E). The points of attachment of the bonding jumper(s) shall be accessible.
(1) General. Metal water piping system(s) installed in or attached to a building or structure shall be bonded to the service equipment enclosure, the grounded conductor at the service, the grounding electrode conductor where of sufficient size, or to the one or more grounding electrodes used. The bonding jumper(s) shall be sized in accordance with Table 250.66 except as permitted in 250.104(A)(2) and (A)(3).

 

[Ponchik]

Bonding is different than using it as a grounding electrode. For bonding it doesn't have to be sized to 250.66. I would size it to largest circuit that MAY energize the water piping system and use table 250.122.

That's not what 250.104(A)(1) says: "Metal water piping systems ...shall be 'bonded' to the svc equipment enclosure, the grounded conductor at the svc, the GEC where of sufficient size or to the one or more electrodes used. The 'bonding jumpers' shall be sized in accordance with T250.66.

No mention about 'may energize the water piping system.'

:slaphead:
You are correct. For some reason i thought the OP was asking for Building with multiple units. hence i thought of 250.122 as mentioned in 250.104(A)(2)