bonding grid joined to equipment ground at motor casing.....

[CMEFAY]

My understanding of an equipotential bonding grid as required by 680.26 is that the grid is to be isolated from any equipment ground. But when you bond to the motor casing lug, it is screwed to the casing and so is the equipment ground, which bonds the equipotential bonding grid to the equipment ground through the motor casing. Shouldn't the pool pump manufacturers isolate the equipment ground from the motor casing?

Thanks, Lori

 

[Dennis Alwon]

Read art 680.26(B)(4) second paragraph. I am not sure where you got the idea that the bonding grid should be separate from the EGC. where does article 680.26 say you cannot tie the egc to the grid. In fact 680.26(C) says the parts in 680.26(B) shall be connected to an equipotential bonding grid.

 

[CMEFAY]

bonding grid joined to equipment ground

bonding grid joined to equipment ground

Thanks for your prompt reply. Sadly, my jurisdiction is still under the 1999 code where there is no specific reference to the equipment ground. I have reread the 2002 and the 2005 as you suggested, and sure enough--there it is under the double-insulated water pump motor requirements (which I skipped over cuz I didn't think it would be the info I was looking for). That is a load off my mind, cuz I was beginning to think I was doing something wrong! I appreciate this forum--I come here on a regular basis to brainstorm with other electricians, cuz I'm the lone ranger here in Loves Park!

Sincerely, Lori