Metal surfaces exposed are to be bonded using what size bonding jumper? For multiple metal equipment connected to a common bonding connection, does this connection have sizing requirements for a conductor that goes back to the ground terminal on the main service switchboard?
Bonding metal surfaces
- Thread starter cppoly
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Details?
It depends on what it is and where it is located with respect to the electrical distribution. In short, based on circuit 'likely' to energize it. In most cases on the load side of the service or SDS disconnecting means, the EGC is permitted to serve as the bonding jumper [250.122]. Otherwise there's 250.66 or solid mechanical means.
It depends on what it is and where it is located with respect to the electrical distribution. In short, based on circuit 'likely' to energize it. In most cases on the load side of the service or SDS disconnecting means, the EGC is permitted to serve as the bonding jumper [250.122]. Otherwise there's 250.66 or solid mechanical means.
For an it equipment room, there's a requirement to ground all racks, cable trays, and other exposed metal to a ground bar in the room. How would the bonding jumper be sized for each piece of equipment to the ground bar and then the final connection of the ground bar (which has all these connections) back to a water main, building steel or ground bus in a main switchboard?
Sounds like a job spec' requirement. The NEC does have grounding/bonding requirements, but I summed them up in previous post. You will have to comply with those requirements where the job spec' differs. We can get into each item individually if need be. Where NEC and spec's differ, it'll end up being redundant grounding, so you'll have to RFI whoever issued the spec's to be sure.
It is based on the size of the circuit that may energize it.
If no circuit is going to it and there is NO CHANCE that it will get energized then why does it need bonding?
Thank you. Do you know what section it is that you are referencing about sizing the jumper based on the circuit likely to energize the metal?
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