Bonding of equipment ground conductor

Status
Not open for further replies.

mull982

Senior Member
I posted this in the Engineering/Calculations section but didn't get much of a response. Hopefully someone here can help.

I was having trouble interpreting three similar sections of the code and was hoping that someone could further clarify.

1) Section 250.118(6) states that liquidtight flexible metal conduit can be used as the primary equipment ground conductor if it meets all of the requirement listed. One of the requirements listed is that the feeder circuit cannot exceed 20A or 60A depending on the trade size of the LFMC. Does this mean and any circuit over 60A run in LFMC cannot use the LFMC as a primary EGC?

2) Also confusing me is section 250.102(E) which talks about equipment bonding jumpers. Where and when are these equipment bonding jumpers necessary, and are they necessary when using LFMC as a EGC as mentioned above in 1). Do I need these bonding jumpers when using LFMC as an ECG? Does it have anything to do with the size of the circuit?

3) The last section that applies to the two topics above is 501.30B having to do with equipment grounding conductors in hazardous areas. If using LFMC as an primary EGC in a class I area is this external bonding jumper necessary? How about if the LFMC is not being used as the primary ECG (other ECG installed) then is this bonding jumper still necessary?

I would appreciate any further explanation of these three sections
 
1) yes
2) if the flexible conduit is not suitable for use as the EGC a bonding jumper or inter EGC is required
3) with few exceptions, flexible conduit in a classified area requires a bonding jumper or internal EGC
 
don_resqcapt19 said:
3) with few exceptions, flexible conduit in a classified area requires a bonding jumper or internal EGC
Am I reading the following wrong?

250.100 Bonding in Hazardous (Classified) Locations.
Regardless of the voltage of the electrical system, the electrical continuity of non?current-carrying metal parts of equipment, raceways, and other enclosures in any hazardous (classified) location as defined in 500.5 shall be ensured by any of the bonding methods specified in 250.92(B)(2) through (B)(4). One or more of these bonding methods shall be used whether or not equipment grounding conductors of the wire type are installed.
 
Status
Not open for further replies.
Top