Whichever is closer.Does the building steel get bonded to the 200 or 400 amp service?
It's a placed on concrete and bolted down type. I'm hoping it falls under 250.122, but my concern is that metal structure framing falls under 250.68 C 2 as a GEC. Which could really screw me up.Describe the building. Is it steel posts into the earth, or a metal building placed on and bolted down to a concrete slab?
I had an inspector want a metal pool pump shed bonded. How he thought it may become energized I don't know, but he wanted a conductor sized per 250.122 which was #10 copper in my case.
It is not a grounding electrode. It can be a bonding means to the grounding electrode.Building steel no longer qualifies as a grounding electrode unless it is bonded to the ufer, so the sub panel egc bonds it.
Thought that was what I said?It is not a grounding electrode. It can be a bonding means to the grounding electrode.
it doesn't matter the bonding conductor is sized per Table 250.102(C)(1). However that bonding is only required if the steel structure is likely to become energized. See 250.104(C). Note the permitted connection points in 250.104(C)(1) through (5).It's a placed on concrete and bolted down type. I'm hoping it falls under 250.122, but my concern is that metal structure framing falls under 250.68 C 2 as a GEC. Which could really screw me up.
it doesn't matter the bonding conductor is sized per Table 250.102(C)(1). However that bonding is only required if the steel structure is likely to become energized. See 250.104(C). Note the permitted connection points in 250.104(C)(1) through (5).
The way I read it, the bonding conductor to the steel is based on the size of the service entrance conductors.Got it. So for my subpanel I ran 4/0 AL with a 4 AL ground, which is fine, for this situation I need to bond to the building steel using 2 AL (would probably do 4 copper though) but just to compare to my EGC...do I need to replace my 4 AL because its not as big as a bonding jumper?