ryan_618
Senior Member
- Location
- Salt Lake City, Utah
Silly me, I thought I had a good grasp on GEC's. Reading article 250.54 makes me wonder, though. Scenario: 400A service. Available electrodes: water pipe and concrete encased. The Ufer can be used to satisfy the requirement of a supplemental electrode to the water pipe, as required by 250.53 (D)(2). A 1/0 copper was ran to the water pipe as per art.250.66 (Service entrance conductors sized per 310.15 fo residential). The conductor to the concrete encased was #6. I believe that it must be #4, as per 250.66(B).
250.50 states that if available, each electrode listed in 250.52 (A)(1)through(A)(6) shall be bonded together to form the grounding electrode system. Why does 250.54 state that a supplement grounding electrode need not be bonded in accordance with 250.50? Also see 250.53 (D)(2) which states that the GEC of the supplement shall permitted to be bonded... This seems contridicting to me. So if there were steel, ufer, water pipe, rod, pipe, plate & ring...none of them would have to be bonded together because they could all be considered supplements? Am I reading this wrong?
Also, can someone verify the sizing of the Ufer ground in the above case (#4)?
Thanks in advance for your replies.
250.50 states that if available, each electrode listed in 250.52 (A)(1)through(A)(6) shall be bonded together to form the grounding electrode system. Why does 250.54 state that a supplement grounding electrode need not be bonded in accordance with 250.50? Also see 250.53 (D)(2) which states that the GEC of the supplement shall permitted to be bonded... This seems contridicting to me. So if there were steel, ufer, water pipe, rod, pipe, plate & ring...none of them would have to be bonded together because they could all be considered supplements? Am I reading this wrong?
Also, can someone verify the sizing of the Ufer ground in the above case (#4)?
Thanks in advance for your replies.