I am designing the electrical connections for a electrolytic cell.
I have questions relating to the following sections of the NEC:
250.22 (3) states that electrolytic cells shall not be grounded.
Is this refering to grounding one leg of the power system (as in automotive)?
668.3 states that equipment associated with the cell line dc power circuits shall not be required to comply with 250.
Does this include bonding of the non-current carrying metal parts?
668.11 (B) states that all metal enclosures of power supply apparatus for the dc cell line process over 50V shall be grounded.
Sounds like bonding, but what about the rest of the metal parts on the system?
The system I am working on is completely closed and the metal frame is completely isolated from the chemical process (i.e. there is no chance of leakage current except under fault).
I would think that if a fault occurs that inadvertantly energizes the frame that it should be bonded to ensure the breaker trips.
Let me know if I am way off on this one.
c
I have questions relating to the following sections of the NEC:
250.22 (3) states that electrolytic cells shall not be grounded.
Is this refering to grounding one leg of the power system (as in automotive)?
668.3 states that equipment associated with the cell line dc power circuits shall not be required to comply with 250.
Does this include bonding of the non-current carrying metal parts?
668.11 (B) states that all metal enclosures of power supply apparatus for the dc cell line process over 50V shall be grounded.
Sounds like bonding, but what about the rest of the metal parts on the system?
The system I am working on is completely closed and the metal frame is completely isolated from the chemical process (i.e. there is no chance of leakage current except under fault).
I would think that if a fault occurs that inadvertantly energizes the frame that it should be bonded to ensure the breaker trips.
Let me know if I am way off on this one.
c