404.9(B) Grounding.
Snap switches, dimmers, and control switches shall be connected to an equipment grounding conductor and shall provide a means to connect metal faceplates to the equipment grounding conductor, whether or not a metal faceplate is installed. Metal faceplates shall be bonded to the equipment grounding conductor. Snap switches, dimmers, control switches, and metal faceplates shall be connected to an equipment grounding conductor using either of the following methods:
- (1)
The switch is mounted with metal screws to a metal box or metal cover that is connected to an equipment grounding conductor or to a nonmetallic box with integral means for connecting to an equipment grounding conductor.
- (2)
An equipment grounding conductor or equipment bonding jumper is connected to an equipment grounding termination of the snap switch.
Exception No. 1 to (B):
Where no means exists within the enclosure for bonding to the equipment grounding conductor, or where the wiring method does not include or provide an equipment grounding conductor, a snap switch without a connection to an equipment grounding conductor shall be permitted for replacement purposes only. A snap switch wired under the provisions of this exception and located within 2.5 m (8 ft) vertically, or 1.5 m (5 ft) horizontally, of ground or exposed grounded metal objects shall be provided with a faceplate of nonconducting noncombustible material with nonmetallic attachment screws, unless the switch mounting strap or yoke is nonmetallic or the circuit is protected by a ground-fault circuit interrupter.
Exception No. 2 to (B):
Listed kits or listed assemblies shall not be required to be bonded to an equipment grounding conductor if all of the following conditions are met:
- (1)
The device is provided with a nonmetallic faceplate, and the device is designed such that no metallic faceplate replaces the one provided.
- (2)
The device does not have mounting means to accept other configurations of faceplates.
- (3)
The device is equipped with a nonmetallic yoke.
- (4)
All parts of the device that are accessible after installation of the faceplate are manufactured of nonmetallic materials.
Exception No. 3 to (B):
A snap switch with integral nonmetallic enclosure complying with
300.15(E) shall be permitted without a bonding connection to an equipment grounding conductor.