OK, so this is a not enough information question. service in a new building requires a concrete encased electrode, commonly called a UFER. It only requires one. If you have multiple footers, but one service, then one bond is required. If you pour a footer for a chiller and decide to bring bonding conductor from the footer to the case of the chiller which is often done, for grounding, then you are just required to bring your EGC with the feeder which will electrically connect to that footer bond. So no.
Let's say though that you have building with an inadequate existing grounding electrode system. When you pour the footer you could install a UFER and then bond it to the service bonding point reinforcing the building's existing system.