GEC splice...

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Cow

Senior Member
Location
Eastern Oregon
Occupation
Electrician
I'm going to take a stab at it, since I had an inspector point it out to me. Not all crimps, lugs, etc are grounding and bonding rated. The YGS8C is.
 
kwired

kwired

Electron manager
Location
NE Nebraska
Cow said:
I'm going to take a stab at it, since I had an inspector point it out to me. Not all crimps, lugs, etc are grounding and bonding rated. The YGS8C is.
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I would have taken pretty much the same stab at it. I did not look it up but am pretty certain the catalog number with the "G" in it is the one rated for grounding. It also likely recommends a different crimping tool than the other model, I think that is true for most all connectors rated for grounding, I think they compress at a higher pressure level.
 
1793

1793

Senior Member
Location
Louisville, Kentucky
Occupation
Inspector
kwired said:
I would have taken pretty much the same stab at it. I did not look it up but am pretty certain the catalog number with the "G" in it is the one rated for grounding. It also likely recommends a different crimping tool than the other model, I think that is true for most all connectors rated for grounding, I think they compress at a higher pressure level.
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I just wonder why would grounding need to have a higher pressure level than any other splice?
 
sandsnow

sandsnow

Senior Member
Location
Southern California
There are two cases I found where the connection has to be made with a device listed for grounding and bonding. The splicing of the GEC and the Intersystem Bonding terminal 250.94.

Everything else has the option of using simply Listed devices. Even the where a ground bus (to connect bonding jumpers to) in 250.64(F) just requires listed connector.

Doesn't seem to make sense.
 
1793

1793

Senior Member
Location
Louisville, Kentucky
Occupation
Inspector
sandsnow said:
There are two cases I found where the connection has to be made with a device listed for grounding and bonding. The splicing of the GEC and the Intersystem Bonding terminal 250.94.

Everything else has the option of using simply Listed devices. Even the where a ground bus (to connect bonding jumpers to) in 250.64(F) just requires listed connector.

Doesn't seem to make sense.
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You can say that again. I guess I need to start looking for the correct tools and materials.
 
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gndrod

Senior Member
Location
Ca and Wa
Burndy

Burndy

1793 said:
What is the difference between a Brundy YS8C and a YGS8C crimp as it relates to splicing a GEC, indoors?
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Hi Norb,

It's been a while, but your question needs a simple answer. Burndy has been around as long as I remember when installing rack and panel equipment in the 50's. The difference has a two-fold answer....that YS8C is either an 8 Awg Cu-tin plated inline splice HYLINK crimp barrel or HYLUG one hole crimp copper tin-plated 8 Awg lug.

The YGS8C is a HYGROUND 8 Awg compression terminal of various configurations that are used to bond a cross-grid system together in a foundation (rebar cross-grid) or direct buried configuration such as used in radio tower ground ring splices. I would say that the old technology has disappeared for bonding Cu direct burial rays from a ring, but the cross-grid rebar or shield grid bonding in structures is very common. I hope this helps. rbj
 
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