250.104 is for bonding
B) is for "other metal piping" and says the bonding jumper must be sized per the equipment grounding conductor of the circuit likely to energize the piping. There are multiple options of where it may run to.
(D) is for bonding to separately derived systems, parts 1 and 2 both say the conductor needs to be sized to 250.66 part 3 is for a common conductor running between separately derived systems -might be most popular use on a high rise type building, it sends you to 250.30(A)(6) for more details - I believe when using this it will usually be 3/0 copper conductor for the common conductor but connections to individual SDS's would still be based on 250.66.