malachi constant
Senior Member
- Location
- Minneapolis
Forgive my terms here, as grounding and bonding is not my area of expertise.
Situation is a new office building with 480V service, occupants moved in a few months ago. I'm the engineer of record on this project. Electrodes are properly bonded at service main ground bar, and at step down transformers (separately derived systems). Bonding conductors all appear properly sized and connected. There is a parallel telecommunications grounding system and the technology designer says it is as near as they can tell properly grounded per their TIA 607-based details.
The issue is: some AV equipment is having issues, and in troubleshooting the issues it was noted that when AV head-end equipment is plugged into a UPS power outlet (fed from a central UPS) it experiences the issue. (Something to do with devices out in the conference rooms rebooting, or not rebooting on command, or something like that - I don't know the details.) When the AV head end is plugged into a normal power outlet the issue goes away. The thinking is that the head end equipment within the data room is on one ground plane (the UPS plane), and the equipment out in the conference room is on another plane (the utility plane), and the resistance/voltage difference between them is causing the issue.
The main telecommunications room has a central UPS installed within it, 480V in 208V out, so is a separately derived system. We have observed that the UPS bonds to structural steel, and in the same room the telecommunications ground bar bonds to structural steel (the bonds are inches apart on the steel). There is not a direct connection between the UPS 208V panel ground bar, and the telecommunications ground bar in the same room. Further troubleshooting tells us although all normal panels/outlets seem to have a strong ground bond, the UPS outlets do not. Specifically there is 0.1 ohm measured between neutral and ground at all normal outlets, but at all UPS outlets that N-G measurement is over 1 ohm.
The technology designer recommends bonding the telecom ground bar to the ground bar within the UPS power panel, per TIA 607 6.5.1. "When an Electrical Distribution Panel (EDP) is in the same room as the TMGB/TGB that EDP's equipment grounding bus or the panelboard enclosure shall be bonded to the TMGB/TGB using bonding conductors sized..." In my limited past history with grounding and bonding, my understanding of the theory was you earthed the heck out of the system at the main ground, and then everything tied back into that main ground bar more or less in series. Like you bond the outlet to the ground bus in the panel, and the ground bus in the panel is bonded back to the main - but you avoid tying that panel bus to anything else (such as other panel busses) so as to avoid ground loops or something. So I am wary of tying panel ground busses into the technology ground bus. But even more so I am guessing my understanding of grounding code/theory is flawed and this is the right thing to do. Any insight / questions / concerns the community has is appreciated.
Situation is a new office building with 480V service, occupants moved in a few months ago. I'm the engineer of record on this project. Electrodes are properly bonded at service main ground bar, and at step down transformers (separately derived systems). Bonding conductors all appear properly sized and connected. There is a parallel telecommunications grounding system and the technology designer says it is as near as they can tell properly grounded per their TIA 607-based details.
The issue is: some AV equipment is having issues, and in troubleshooting the issues it was noted that when AV head-end equipment is plugged into a UPS power outlet (fed from a central UPS) it experiences the issue. (Something to do with devices out in the conference rooms rebooting, or not rebooting on command, or something like that - I don't know the details.) When the AV head end is plugged into a normal power outlet the issue goes away. The thinking is that the head end equipment within the data room is on one ground plane (the UPS plane), and the equipment out in the conference room is on another plane (the utility plane), and the resistance/voltage difference between them is causing the issue.
The main telecommunications room has a central UPS installed within it, 480V in 208V out, so is a separately derived system. We have observed that the UPS bonds to structural steel, and in the same room the telecommunications ground bar bonds to structural steel (the bonds are inches apart on the steel). There is not a direct connection between the UPS 208V panel ground bar, and the telecommunications ground bar in the same room. Further troubleshooting tells us although all normal panels/outlets seem to have a strong ground bond, the UPS outlets do not. Specifically there is 0.1 ohm measured between neutral and ground at all normal outlets, but at all UPS outlets that N-G measurement is over 1 ohm.
The technology designer recommends bonding the telecom ground bar to the ground bar within the UPS power panel, per TIA 607 6.5.1. "When an Electrical Distribution Panel (EDP) is in the same room as the TMGB/TGB that EDP's equipment grounding bus or the panelboard enclosure shall be bonded to the TMGB/TGB using bonding conductors sized..." In my limited past history with grounding and bonding, my understanding of the theory was you earthed the heck out of the system at the main ground, and then everything tied back into that main ground bar more or less in series. Like you bond the outlet to the ground bus in the panel, and the ground bus in the panel is bonded back to the main - but you avoid tying that panel bus to anything else (such as other panel busses) so as to avoid ground loops or something. So I am wary of tying panel ground busses into the technology ground bus. But even more so I am guessing my understanding of grounding code/theory is flawed and this is the right thing to do. Any insight / questions / concerns the community has is appreciated.