Lets get back to the original question,
645.15 Equipment Grounding and Bonding. All exposed non–current-carrying metal parts of an information technology system shall be bonded to the equipment grounding conductor in accordance with Parts I, V, VI, VII, and VIII of Article 250...
As this is a separate structure, we are all in agreement that a grounding electrode must be added. The question is, should the Isolated ground in the new enclosure be bonded to the new/closest ground rod. or remain isolated for 100's of feet first to a isolated bus in a IT only building then to the isolated triad.
It is my belief that the code requires the initial IG to GEC/EGC bond to be at the new enclosure. If I am wrong, I would like to know and to learn more.
Here is a link to an article in Electrical Contractor
https://www.ecmag.com/section/codes-standards/grounding-and-bonding-requirements-nec
Now lets say the hot, for whatever reason, comes in contact with the Isolated Ground. There is no "Low Impendence Path" back to the source. It will travel thru the IG network, to the IG triad. How many ohms between the triad, and the GEC at the transformer feeding the power panel? I am willing to bet it is a lot, MUCH more than 25 ohms. Lets do some simple math I stole from one of Mike Holts books. E/IR 120V 25 ohms = 5A. The OCPD will NEVER trip. So Sad Too Bad Your Dead. Hope he had good life insurance. That is why I believe that a bond is required at the new RIO DCS panel. To trip the feeder breaker.
The purpose statement of the
NEC, section 90.1(A) states, “The purpose of this Code is the practical safeguarding of persons and property from hazards arising from the use of electricity.” The NEC DOES NOT CARE about noise on electronic equipment. It is all about life safety.