I am currently helping to install a new service to a building. Service is 3000A,3-Ph.,4W,208V-feed comes from new pad mounted outdoor X-former and feeds main disc. inside building. Partner says we need to "bond" at both X-former and Main disc. I say we could "bond" at either place, but it is not acceptable to bond at both places. Am I right? If so hows about some NEC code sections to shut him up.