Miguel c
Member
- Location
- Barranquilla colombia
- Occupation
- Bilingual agent
1. I am a little bit confused. Should there be a main bonding jumper between the metal frame of a first disconecting means or service panelboard and the grounding electrode conductor? The reason I asked is because I have seen some graphics in which there is not any bonding jumper between those.
2. Should there be a bonding jumper between the EGC and the metal frame of a subpanel?
2. Should there be a bonding jumper between the EGC and the metal frame of a subpanel?