Grouch
Senior Member
- Location
- New York, NY
Hi.
Back with more questions!
.
So I'm stuck on the 2008 NEC code... however I do glance at the 2017 code, at article 690, to see if it's a little clearer. A lot of things were re-organized. Some questions I still have:
1. I see diagrams (google
), and drawings from engineers, where:
a) each PV string (say 10 modules in a string) has its own EGC, and then all the EGC's connect together to one EGC that goes to the inverter.
b) I also see diagrams where each PV module in adjacent strings are bonded together, and then only one EGC, on the side of the array, that goes back to the inverter.
Which is the correct way? Or are they both allowed? From reading section 690.45, the EGC is sized based on the OCPD serving that string. So to me it sounds like only a) above would be allowed. But I know b) is allowed also.
2. NEC 2008 section 690.47(C)(3). I cannot picture what this section is trying to say. is there a diagram somewhere that can help?
3. NEC 2008 (or 2017) section 690.46. why is this a separate section? it seems to only talk about the size of the EGC. Shouldn't this be just a sub-section of 690.45? I don't understand why it's titled 'Array Equipment Grounding Conductors', if it's talking about the EGC size from section 690.45. Is this something else entirely?
4.
Back with more questions!

So I'm stuck on the 2008 NEC code... however I do glance at the 2017 code, at article 690, to see if it's a little clearer. A lot of things were re-organized. Some questions I still have:
1. I see diagrams (google
a) each PV string (say 10 modules in a string) has its own EGC, and then all the EGC's connect together to one EGC that goes to the inverter.
b) I also see diagrams where each PV module in adjacent strings are bonded together, and then only one EGC, on the side of the array, that goes back to the inverter.
Which is the correct way? Or are they both allowed? From reading section 690.45, the EGC is sized based on the OCPD serving that string. So to me it sounds like only a) above would be allowed. But I know b) is allowed also.
2. NEC 2008 section 690.47(C)(3). I cannot picture what this section is trying to say. is there a diagram somewhere that can help?
3. NEC 2008 (or 2017) section 690.46. why is this a separate section? it seems to only talk about the size of the EGC. Shouldn't this be just a sub-section of 690.45? I don't understand why it's titled 'Array Equipment Grounding Conductors', if it's talking about the EGC size from section 690.45. Is this something else entirely?
4.
