hhsting
Senior Member
- Location
- Glen bunie, md, us
- Occupation
- Junior plan reviewer
I have encapsulated reinforcing steel for pool shell. Therefore copper grid is being used in pool shell.
However I am confused about pool perimeter bonding. NEC 2017 says I can use 680.26(B)(2)(a) or 680.26(B)(2)(b) and says to bond to pool reinforcing steel or copper conductive grid at 4 uniform points but then says for nonconductive pool shell bonding at 4 points shall not be required.
Following questions:
1. So does this mean in my case i dont need to bond the perimeter surface grid to the copper grid since my shell reinforcing steel is encapsulated or i can bond perimeter surface grid to the reinforcing steel but thats encapsulated?
2. NEC 2017 section 680.26(B)(2)(a) is it for encapsulated or non encapsulated pool shell reinforcing steel?
However I am confused about pool perimeter bonding. NEC 2017 says I can use 680.26(B)(2)(a) or 680.26(B)(2)(b) and says to bond to pool reinforcing steel or copper conductive grid at 4 uniform points but then says for nonconductive pool shell bonding at 4 points shall not be required.
Following questions:
1. So does this mean in my case i dont need to bond the perimeter surface grid to the copper grid since my shell reinforcing steel is encapsulated or i can bond perimeter surface grid to the reinforcing steel but thats encapsulated?
2. NEC 2017 section 680.26(B)(2)(a) is it for encapsulated or non encapsulated pool shell reinforcing steel?