Print spec question

[joeyww12000]

After reading one of my several posts on grounding and bonding I noticed a design flaw in the prints on my current job. 3/0cu derived phase conductors on a seperately derived system, specs call for 1/0cu GEC. Thats fine just oversized, but system equipment bonding jumper calls for #6cu to be pulled with phase conductors to panel? Is this correct or doesnt the equipment bonding jumper need to be a 1/0cu also?

 

[iwire]

250.30(A)(1) takes you to 250.28(D) which brings you to 250.66.

So in short, the bonding jumper of a separately derived system shall be sized using Table 250.66 and the size of the derived phase conductors.

 

[iwire]

FWIW on something like this I would not bother with an "RFI" (Request For Information) to the engineer, I would just use a left over piece of phase conductor.