I am working on a project with a High Resistance to Ground System and not being that familiar with this type of grounding system I would like some pointers.
First the High Resistance to Ground System has been designed by others and as I have researched in the NEC this system can only be used on 3 phase 480-1000V systems per NEC 250-36 and then only if it meets the criterial listed. Well my first issue is that it has been proposed for a high voltage system with transformers at 34.5 KV Primary and the secondary side range from 480/277V to 4160/2400V Also a Generator Unit at 38KV. I do not see how this is code compliant.
Secondly they have requested tapping my Grounding Ring System into their High Resistance to Ground System at multiple locations from each transformer and the generator system which also has me confused. Per the NEC 250-36(E) the equipment bonding jumper shall be connected via an unspliced conductor run from the first system disconnecting means or overcurrent device to the grounded side of the grounding impedience and the grounding electrode (grounding ring) per NEC 250-36(F) shall be connected at any point from the grounded side of the grounding impedience to the equipment grounding connection at the service equipment or first system disconnecting means. Which I believe allows me to tie my Grounding Ring System into the main Grounding Bus in the service equipment MDP with a single grounding conductor to the grounded side of the Grounding Impedience in the High Resistance to Ground System cabinet.
Please let me know your thoughts. Thanks
First the High Resistance to Ground System has been designed by others and as I have researched in the NEC this system can only be used on 3 phase 480-1000V systems per NEC 250-36 and then only if it meets the criterial listed. Well my first issue is that it has been proposed for a high voltage system with transformers at 34.5 KV Primary and the secondary side range from 480/277V to 4160/2400V Also a Generator Unit at 38KV. I do not see how this is code compliant.
Secondly they have requested tapping my Grounding Ring System into their High Resistance to Ground System at multiple locations from each transformer and the generator system which also has me confused. Per the NEC 250-36(E) the equipment bonding jumper shall be connected via an unspliced conductor run from the first system disconnecting means or overcurrent device to the grounded side of the grounding impedience and the grounding electrode (grounding ring) per NEC 250-36(F) shall be connected at any point from the grounded side of the grounding impedience to the equipment grounding connection at the service equipment or first system disconnecting means. Which I believe allows me to tie my Grounding Ring System into the main Grounding Bus in the service equipment MDP with a single grounding conductor to the grounded side of the Grounding Impedience in the High Resistance to Ground System cabinet.
Please let me know your thoughts. Thanks