The Supply Side bonding jumper for seperately derived systems ( with bonding at source ) is sized according to 250.102.C.
The equipment ground conductor is sized according to 250.122 ( according to the overcurrent device ).
I have a 5000A transformer ( seperately derived source ), from the secondary of the transformer to the first disconnect I need to pull 15 sets of conductors in 15 raceways.
Sizing the bonding jumper according to the 250.102.C, the biggest conductor is 500 MCM so I choose 1/0 to run in each raceway.
Leaving the 5000A breaker, I run to another switchgear with 5000As. Again I have 15 sets of conductors in 15 raceways but this time to size the EGC i use 250.122, I end up with 700 kcmil in each raceway.
How come the ground fault at the load ( that will pass through the EGC than the SSBJ than the system bonding jumper to return to the source ), needs a 700 kcmil than downsizes to 2/0 on the way ? Am I getting it wrong ?
Any help appreciated.
The equipment ground conductor is sized according to 250.122 ( according to the overcurrent device ).
I have a 5000A transformer ( seperately derived source ), from the secondary of the transformer to the first disconnect I need to pull 15 sets of conductors in 15 raceways.
Sizing the bonding jumper according to the 250.102.C, the biggest conductor is 500 MCM so I choose 1/0 to run in each raceway.
Leaving the 5000A breaker, I run to another switchgear with 5000As. Again I have 15 sets of conductors in 15 raceways but this time to size the EGC i use 250.122, I end up with 700 kcmil in each raceway.
How come the ground fault at the load ( that will pass through the EGC than the SSBJ than the system bonding jumper to return to the source ), needs a 700 kcmil than downsizes to 2/0 on the way ? Am I getting it wrong ?
Any help appreciated.