Telecommunications grounding/bonding requirements

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Hi where in the NEC code aticle has requirements for telecommunications bonding/grounding requirements?

Had your previous post on this topic been allowed to continue, I would have pointed you to TIA 607 which sets the standard for commercial telecommunications space grounding and bonding. There is a lot to know but a few googles will help shed some light. NEC does not cover this adequately for commercial telco spaces.

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https://www.bicsi.org/uploadedFiles/PDFs/Conferences/India/07-Panduit final Preso - OK.pdf
 
There are lots of standards, but only one code, which is NEC Section 250 as amended by Chapter 8 plus individual manufacturer instructions that may apply due to installed equipment.

All of the other standards, such as TIA, IEEE, Motorola, BICSI, etc are nice but only enforceable if your contract requires it.
 
There are lots of standards, but only one code, which is NEC Section 250 as amended by Chapter 8 plus individual manufacturer instructions that may apply due to installed equipment.

All of the other standards, such as TIA, IEEE, Motorola, BICSI, etc are nice but only enforceable if your contract requires it.
:thumbsup:

Roger
 
There are lots of standards, but only one code, which is NEC Section 250 as amended by Chapter 8 plus individual manufacturer instructions that may apply due to installed equipment.

All of the other standards, such as TIA, IEEE, Motorola, BICSI, etc are nice but only enforceable if your contract requires it.

I will say that Motorola's R-56 standards quote any NEC codes for their requirements and then go above the minimum code reference.
 
Is there anything in Chapter 8 that would require the telecom grounding and bonding to be separate from the electrical except for maybe at one point? If you had a common grounding riser {250.30(A)(6)} for transformers in an all poured concrete building could you also use that for the telecom?
 
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