Transformers/First Overcurrent Protection Bonding/Grounding Target Point

[Kevyn O]

I know the target point for Bonding a XFRM / First Overcurrent either Panel or disconnect can be done at either place.
Which is the best method?
If I put all including Steel, Water Pipe, Rebar, Ground Rods and equipment grounds at the first overcurrent device do I still need to bond XO to the enclosure of the XFRM?

 

[jumper]

No. XO is not directly connected to the xfmr case if the SBJ and GES is established at the first disconnect.

 

[augie47]

If you elect to bond at the panel you will need an equipment bonding jumper (conductor or 250.118 raceway) between the panel and the transformer case.'

See 250.30

thought I was seeing double this morning.... sorry, jumper. posted on top of you.

 

[Smart $]

...If you elect to bond at the panel you will need an equipment bonding jumper (conductor or 250.118 raceway) between the panel and the transformer case...

Dubbed a Supply-Side Bonding Jumper [250.30(A)(2)]

 

[infinity]

Also as Augie stated the SSBJ can be a suitable metallic raceway.

 

[don_resqcapt19]

If you elect to bond at the panel you will need an equipment bonding jumper (conductor or 250.118 raceway) between the panel and the transformer case.'

See 250.30

...

The requirement for the supply side bonding jumper is the same no matter where the system bonding jumper is installed.