Which method(s) apply

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hhsting

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In the attached sketch which method(s), Method #1, Method#2, or both Methods #1 and #2 comply to NEC 2014 Section 250.94(4)?
 

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I don't think you've ever been exposed to Charlie's Rule for interpreting the NEC. I couldn't find a link to the original but here is a transcript of a copy I typed out a long time ago before I even had a printer.
It doesn't say what you think it says, nor what you remember it to have said, nor what you were told that it says, and certainly not what you want it to say. If by chance you are its author, it doesn't say what you intended it to say. Then what does it say? It says what it says. So if you want to know what it says, stop trying to remember what it says, and don't ask anyone else. Go back and read it again and pay attention as though you were reading it for the first time.
 
Please I am really stuck on this. I read it again and again but I am not sure. That paragraph I am really stuck. Any help from all of you experts here would be really appreciated.
 
Write this out and hold it under you drawing on the right-
...or be mounted at one of these enclosures and be connected... to the enclosure with a minimum 6AWG copper conductor.

Write this out and hold it under your drawing on the left-
...or be mounted at one of these enclosures and be connected to the enclosure or to the grounding electrode conductor with a minimum 6AWG copper conductor.
 
Method #1 left side what ActionDave is saying would then mean both enclosure and grounding electrode are bonded thru conductor to intersystem bonding termination.

The word OR in NEC 2014 250.94(4) does it mean do one of the following NOT more than one like Method #1?
 
This is the second thread on the same exact question that has been answered before. It really feels like you are trolling the forum. I closed this thread also.
 
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