skeshesh
Senior Member
- Location
- Los Angeles, Ca
The diagram that is confusing me is the one attached. These represent the two different cases where the grounding electrode and system bonding jumper are located at different locations for a SDS. In these diagrams what are the conductors that I have questioned? Are these the EBJ's that were referenced?
The point the diagram is trying to make is you should bond the groundED and groundING (neutral & equipment ground) at only one point or you risk creating parallel return paths. The diagram actually shows the two possible paths with directional arrows on the conductors. As stated by smart as well as the diagram itself this case is definitly a seperately drived system. Try reading the NEC250 a few more times. I know it's a lot to take it when you read it all at once but after the 10th-20th time it all starts to me sense