chip
Member
- Location
- California
I appreciate everbody's input. But whats confusing me is in the 2008 handbook 250.64(E), at the end of the section it explains to use 250.102(C) to size the bonding jumper. Thanks again, Chip
The change for 08 was to clarify bonding is needed only for ferrous raceways.radiopet said:not sure Chip....I have looked at the revisions for 2008 and I dont see anything other than above. I dont have a 2008 Handbook " handy "....but I do have Mikes 2008 NEC Changes and IAEI's 2008 NEC Changes here and I dont see where 250.64(E) has changed....maybe others know but I dont believe in regards to the GEC bonding that it would need to be larger than the conductor you have already run....would not make sense to increase it and still have only 3/0 going to the electrode.....You are just trying to bonded each end of the ferrous raceway....per 250.64(E)
tom baker said:The change for 08 was to clarify bonding is needed only for ferrous raceways.