Bonding at "above ground-nonstorable" pools

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finhead

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Section 680.26(B)(2) refers to bonding perimeter surfaces of the pool. If the pool is above ground, permanently installed, and surrounded by a wood deck, is bonding of the perimeter surface required? While wood is usually considered nonconductive, wet wood is anything but. I just can't think of any way to bond wood.

Your thoughts will be greatly appreciated
Brian Dolan
 
Section 680.26(B)(2) refers to bonding perimeter surfaces of the pool. If the pool is above ground, permanently installed, and surrounded by a wood deck, is bonding of the perimeter surface required? While wood is usually considered nonconductive, wet wood is anything but. I just can't think of any way to bond wood.

Your thoughts will be greatly appreciated
Brian Dolan

This has come up before and I believe the response was that it must be bonded. The only way I can think of is to run a conductors under the boards of the deck.
 
I realize this has come up before and I am now of the opinion that this question will continue to come up until more (extensive) clarification can be provided from CMP 17. This particular issue is actually several Code cycles old and similar questions have existed for pools, spas and hot tubs alike, for some time… I for one believe that the language in 680.26 for the 08 cycle is some of the best we have had, but it has no specific language which addresses many of the questions which arise for particular installations such as the one posed by the OP. (... if anything it reveals how incredibly difficult it must be to create language which is suitable for an unlimited number of possibilities...)


In this particular instance and example, I think it is quite important to bear in mind that the prescriptive requirements of Section 680.26(B) are solely and wholly provided to satisfy the performance requirements of Section 680.26(A). (...reducing voltage gradients in the pool area ...)

In this particular example noted by the OP, is there really any perimeter bonding for this particular perimeter surface (elevated wood deck) which will in fact contribute anything to the performance requirements of Section 680.26(A)?


I find it extremely hard to believe that there is any bonding of said elevated wood deck which contributes anything to the performance requirements of Section 680.26(A)…

If this is truly necessary I would be interested in exacting prescriptive methods for accomplishing such elevated wood deck bonding… (I am referring specifically to perimeter bonding in 680.26(B)(2) and NOT to any bonding which would be necessary for any above ground pool structural steel which is addressed under Section 680.26(3) in the 08 NEC…)

mweaver
 
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