For new MV busduct installations between transformers and Switchgear I typically see a grounding pad located at both ends of the busduct housing which I'm assuming is intended to have a bonding jumper connected between it and the switchgear/transformer.
When providing this bonding jumper which NEC table in Section 250 applies for sizing this bonding jumper? From what I can tell this bonding jumper should be sized the same ad the EGC size provided in 250.122?
This would mean for a 2000A rated busduct that was installed in a recent application this would require a 250MCM bonding jumper between the busduct housing and switchgear/transformer. Is this correct? This seems like an awfully large bonding jumper to have on the outside of an enclosure?
When providing this bonding jumper which NEC table in Section 250 applies for sizing this bonding jumper? From what I can tell this bonding jumper should be sized the same ad the EGC size provided in 250.122?
This would mean for a 2000A rated busduct that was installed in a recent application this would require a 250MCM bonding jumper between the busduct housing and switchgear/transformer. Is this correct? This seems like an awfully large bonding jumper to have on the outside of an enclosure?
