I'm thinking you have a misconception to the type of GEC-grid I'm referring to in that you say the supply and return are separate. In my experience they are not... this structure's grid is tied to every structure's grid throughout the whole facility. If it's metal, it's bonded... sometimes twice, and that's not counting the conduit or EGC, or incidental contact with other bonded equipment or material.
However, I'm open to correction because I am not part of the design team, so my information is second hand at best... some perhaps just rational speculation
You are correct though about these ["remote"] paths doing little to reduce the impedance. This is the intended result. The theory is, "add a path, reduce the impedance just a bit more", just like adding another resistor to a parallel resistor network, and when done consistently, each reduction in impedance is more minute as the progression continues...