Equipotential Bonding of water in non-conductive (vinyl or fiberglass) pools

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IMHO - yes, that is a completely new requirement but it is pretty spelled out. whereas 680.26(B)(1) spells out that the shell of a fiber/composite pool need not be bonded.
 
speedfreak786 said:
Does the requirement in section 680.26C (2008 NEC) to provide a minimum 9 sq. in intentional bonding surface for the pool water apply to a pool which is considered "non-conductive" -- i.e., a vinyl or fiberglass shell pool?
Click to expand...


No doubt it does in my opinion.

Don't forget a bonded metal ladder could get you over 9 sq in. :smile:
 
Thanks for the responses. I'm just thinking that if there is NOTHING conductive -- not even the pool ladder -- in the pool, then the requirement for equipotential bonding of the water just doesn't seem to make sense. I do agree of course, that if there is a pool ladder or other metal fixture (e.g. underwater light or its niche) then the 9 sq. inches can be easily met. Am I thinking this through correctly? or am I missing something? :confused:
 
We , that are in the 2008 ,..have just got to start thinking of the water as just another component that requires bonding ,..it is possible that,.. all that might require bonding is the water and the perimeter surface...with an extenision long enough for replacement of a double insulated pump,..

(I have had a couple of after dinner drinks , sister in law up from Phili ,..I hope that makes sense)
 
M.D. - Forgive me; but I did not understand what you were trying to say in your response. Those after dinner drinks may have already taken their toll :grin:

Can you please try again. My question is that if the pool is vinyl or fiberglass (i.e., "non-conductive"), and therefore exempt from requiring equipotential bonding as specified in 680.26(B)(1), then why is the water in the non-conductive figerglass/vinyl pool required to be bonded per the description in 680.26(C)?

I guess that the more I read the section 680.26, the more I'm beginning to think that the water in the pool (even if the pool is a non-conductive) is being treated just like any other metallic/conductive component that may be in the pool and therefore may be subjected to a voltage gradient when the bather steps out onto the deck. Any comments will be appreciated. :)
 
Here is the ROP for the new rule, it says rejected but they ended up accepting it.


​




17-122 Log #1894 NEC-P17​
Final Action: Reject​

(680.26(C) (New) )​

____________________________________________________________​


Submitter:​
Frank C. Lambert, Georgia Tech/NEETRAC / Rep. National​

Electric Energy Testing, Research, & Applications Center​

Recommendation:​
Insert a new Section 680.26(C) as follows:​

680.26(C) Pool Water. An intentional bond of a minimum conductive surface
area of 5806 mm 2 (9 in 2 ) shall be installed in contact with the pool water.
This bond shall be permitted to consist of parts that are required to be bonded
in 680.26(B).
Renumber the present sections sequentially from (C) to (D), (D) to (E), and
(E) to (F).​

Substantiation:​
Bonding of metal parts in and around a swimming pool to an​

equipotential bonding grid is extensively covered in 680.26. The intent of this
bonding is to equalize the voltages between the pool water and the deck
including any attached metal structures or parts. 680.26 has been effective in
mitigating stray voltage problems, especially in the case of fiberglass
swimming pools or pools with insulated liners.
680.26 describes various metal parts and equipment that require bonding with
an equipotential bonding grid. In describing these metal parts, it is assumed
that one or more of the parts are in contact with the pool water. This may not
always be the case. Some pools do not have any bonded metal parts in contact
with the water. In such a case, intentional bonding of the water is necessary to
equalize the water-to-deck voltages. Presently, 680.26 does not have a
provision for intentional bonding of the pool water.​

Panel Meeting Action: Reject​


Panel Statement:
The submitter has not provided adequate substantiation.​


There are issues such as conductivity of water, changes with water temperature,
current flow, size of conductors, etc. that need to be addressed.​

​
​
​
​
Number Eligible to Vote: 11​

Ballot Results: ​
​

Affirmative: 9 Negative: 2​


Explanation of Negative:​


HIRSCH, B.: The testing done by the National Electric Energy Testing,
Research and Applications Center (NEETRAC) clearly substantiates that the
potential for shock hazard is increased in pools where the pool water is not
bonded via metal parts in the pool. Results of this testing were reported to
Panel 17 at the proposal meeting in January of 2006. Based on this testing, EEI
supports the adoption of this proposal and as such is voting negative to the
panel?s action. At the proposal meeting, Panel 17 indicated they had additional
questions that needed to be answered before supporting this proposal. The
panel statement, however, did little to document those concerns. Just as the
submitter needs to provide compelling substantiation for a code change, the
code panel has the responsibility to provide a justifiable technical basis to
reject well supported proposals.
JHONSON, D.: I agree with the Submitter?s substantiation, and, in addition,
the substantiation of the NEETRAC testing results reported to Code-Making
Panel 17 at the ROP meeting in January of 2006. I have provided additional
relevant pool test results from a project supervised by the university of
Newcastle, Australia and sponsored by Energy Australia. This reports a
potential shock hazard when conditions exist effectively bridging the isolation
of the pool water provided by an insulated pool shell.
This issue should be revisited.​
Note: Supporting Material is available for review at NFPA headquarters
​
​
​
​

​
 
By bonding a piece of metal that has at least 9 square inches in contact with the water.

A bonded metal pool ladder or a metal wet niche fixture could get it done.
 
Per 680.26(c) you bond the water by ensuring that a conductive surface (e.g., metal) having a minimum surface area of 9 sq. inches is always in contact with the pool water. Additionally that minimum 9 sq. inches of conductive surface is bonded to the equipotential "bonding grid". Metal parts such as ladders in the pool will in most-cases be sufficient to meet this requirement. :)
 
Equipotential Bonding of water in non-conductive(vinyl or fiberglass) pools.

Equipotential Bonding of water in non-conductive(vinyl or fiberglass) pools.

M. D. said:
We , that are in the 2008 ,..have just got to start thinking of the water as just another component that requires bonding ,..it is possible that,.. all that might require bonding is the water and the perimeter surface...with an extension long enough for replacement of a double insulated pump,..

(I have had a couple of after dinner drinks , sister in law up from Phili ,..I hope that makes sense)
Click to expand...

That is how I understand it. Seems that there is not much mentioned about the perimeter bonding,but it is required even for above ground pools and where there is only earth around the pool.

I felt bad for a contractor on an inspection today. He spent a lot of time and effort bonding a insulated 33ft. above ground pool,but did not wire for a perimeter bond.
 
There is a product on the market It is a stainless steel plate with a threaded stud that fits in the skimmer with the stud drilled through the back for the skimmer can for the bonding lug.
 
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