(A) Performance. The equipotential bonding required by this section shall be installed to reduce voltage gradients in the pool area.
(B) Bonded Parts. The parts specified in 680.26(B)(1) through (B)(7) shall be bonded together using solid copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or other identified corrosion-resistant metal. Connections to bonded parts shall be made in accordance with 250.8. An 8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be required to be extended or attached to remote panelboards, service equipment, or electrodes.
(2) Perimeter Surfaces. The perimeter surface shall extend for 1 m (3 ft) horizontally beyond the inside walls of the pool and shall include unpaved surfaces as well as poured concrete and other types of paving. Bonding to perimeter surfaces shall be provided as specified in 680.26(B)(2)(a) or (2)(b) and shall be attached to the pool reinforcing steel or copper conductor grid at a minimum of four (4) points uniformly spaced around the perimeter of the pool. For nonconductive pool shells, bonding at four points shall not be required.
(a) Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with 680.26(B)(1)(a).
(b) Alternate Means. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, a copper conductor(s) shall be utilized where the following requirements are met:
(1) At least one minimum 8 AWG bare solid copper conductor shall be provided.
(2) The conductors shall follow the contour of the perimeter surface.
(3) Only listed splices shall be permitted.
(4) The required conductor shall be 450 to 600 mm (18 to 24 in.) from the inside walls of the pool.
(5) The required conductor shall be secured within or under the perimeter surface 100 mm to 150 mm (4 in. to 6 in.) below the subgrade.