supply side bonding jumper

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jcole

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Lawrenceburg, Kentucky
Hello guys and gals.

The 2011 NEC definition of system bonding jumper is:

"the connection between the grounded circuit conductor and the supply side bonding jumper, or the equipment grounding conductor, or both, at a separately derived system"

What is meant by the supply side bonding jumper? Are they talking about the main bonding jumper of the service and/or the system bonding jumper of the separately derived system supplying the separately derived sytem?

Thanks for all replies.
 
The term "Supply side bonding jumper" is new to the 2011 NEC. Prior to the 2011 NEC this was referred too as an "equipment bonding jumper" in section 250.30(A)(2).

The "Supply side bonding jumper" is the wire type bonding jumper ran from the source if the separately derived system to the first disconnecting means. This wire is ahead of the overcurrent protective device that protects the secondary conductors therefore it can't be sized off of table 250.122 and has to be sized from Table 250.66.

Chris
 
If the system bonding jumper is at the first disconnect means than the wire from sds is called supply side bonding jumper and shall be sized according to 250.66.

If the system bonding jumper is at the sds than the wire from sds to first disconnect means is called an equipment grounding conductor and is sized according to 150.122.

Is this a correct analysis?

Thanks for replies.
 
I won't even attempt to get into the "word game" as those seem to change each Code cycle, but I believe you will find anything on the line side of your first overcurrent device will be 250.66, after the OCP, 250.122.
Without the OCP, the current levels have the capability to be larger than the ones
with OCP.
 
jcole said:
If the system bonding jumper is at the first disconnect means than the wire from sds is called supply side bonding jumper and shall be sized according to 250.66.

If the system bonding jumper is at the sds than the wire from sds to first disconnect means is called an equipment grounding conductor and is sized according to 150.122.

Is this a correct analysis?

Thanks for replies.
Click to expand...

No, that is not correct.

You do not get an equipment grounding conductor until you have an overcurrent protective device which will be located at the first disconnecting means after the SDS.

So regardless of where you do the system bonding jumper the bonding conductor between the SDS and the first disconnecting means will be a supply side bonding jumper and needs to be sized off Table 250.66.

Chris
 
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