I would consider that the well casing is permitted to be used as a grounding electrode by 250.52(A)(7) [2005 Code]
I would also consider it to be a supplemental grounding electrode for the pump, which could be connected to the EGC and would not be required to comply with the electrode bonding requirements, per 250.54. I can't see why bonding would be prohibited, though.
I would also consider it to be a supplemental grounding electrode for the pump, which could be connected to the EGC and would not be required to comply with the electrode bonding requirements, per 250.54. I can't see why bonding would be prohibited, though.