bphgravity
Senior Member
- Location
- Florida
Mark Ode was in town this weekend and I was able to pick his brain for any interesting 2008 information. He confiurmed several of the other posts made here regarding possible changes. Here's a couple other ones:
> All receptacles in wet locations will be required to be listed as suitable for wet locations. Yes, this is the receptacle itself. It is not clear if this would be permitted in lieu of an "in-use" cover or in conjunction with.
> The zone described in 410.4(D) would apply generally and not just for the purposes of that section, meaning the area within the zone will be identified as a wet or damp location for all installations. And with the 2005 change in 406.8(B)(1) which dropped the "outdoor" qualifier, this could mean receptacles in a bathroom within 3' of the shower or tub will require a weatherproof cover.
> 410.73(G) may be expaned to include all branch circuits not just multiwire.
I'll check my notes for some of the others. These are some I remember off the top of my head.
> A proposal was submitted to require metal studding to be bonded regardless if it is exposed to contact and it appears the CMP was in favor of the change.
> All receptacles in wet locations will be required to be listed as suitable for wet locations. Yes, this is the receptacle itself. It is not clear if this would be permitted in lieu of an "in-use" cover or in conjunction with.
> The zone described in 410.4(D) would apply generally and not just for the purposes of that section, meaning the area within the zone will be identified as a wet or damp location for all installations. And with the 2005 change in 406.8(B)(1) which dropped the "outdoor" qualifier, this could mean receptacles in a bathroom within 3' of the shower or tub will require a weatherproof cover.
> 410.73(G) may be expaned to include all branch circuits not just multiwire.
I'll check my notes for some of the others. These are some I remember off the top of my head.
> A proposal was submitted to require metal studding to be bonded regardless if it is exposed to contact and it appears the CMP was in favor of the change.