- Location
- Placerville, CA, USA
- Occupation
- Retired PV System Designer
One conjecture is that if there is a splice or termination in a hot conductor you would like the return path from a ground fault to include the associated EGC too, not just one bonded EGC from another circuit.
Not quite sure why, but it feels like that should be better.
If you have different EGCs, at a minimum you need to bond the largest one. But having all if them together as part of the return path reduces the fault clearing impedance. And therefore the voltage offset of grounded metal in the time before the OCPD operates.
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Not quite sure why, but it feels like that should be better.
If you have different EGCs, at a minimum you need to bond the largest one. But having all if them together as part of the return path reduces the fault clearing impedance. And therefore the voltage offset of grounded metal in the time before the OCPD operates.
Sent from my XT1585 using Tapatalk