Pool Bonding

WD40 said:
What in the world ? Are you speaking for Mike Holt when you say that as an Employee of Mike's site?
680.26 covers pool pump motors under water lighting etc, all kinds of things would be likely to energize a pool grid, its DIY misinformation to say those would not be likely to become energized.
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We do not agree as to the purpose of the pool bonding grid. The grid does its job even if it is energized to 120 volts as Mike showed in one of his videos.

No one ever speaks for Mike Holt other than Mike Holt himself...not even the employees of Mike Holt Enterprises speak for Mike, and as Jim said there are no Mike Holt Enterprise employees that moderate this forum. The only involvement of Mike Holt Enterprises with this forum is the back of the house stuff in running the servers and the software.
 
Its purpose is clear we agree on that, its as soon as you create one its 'likely to become energized' by any number of components.
 
WD40 said:
Its purpose is clear we agree on that, its as soon as you create one its 'likely to become energized' by any number of components.
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Fault clearing is simply not the purpose of equipotential bonding. The problem with thinking it is is the fact that the culprit may not be caused by the electrical source of the pool, it can be from the utility or the neighbor, but if everything is energized to the same potential there is no problem
 
roger said:
Fault clearing is simply not the purpose of equipotential bonding. The problem with thinking it is is the fact that the culprit may not be caused by the electrical source of the pool, it can be from the utility or the neighbor, but if everything is energized to the same potential there is no problem
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I agree its not the purpose 100% with you there and its very existence, regardless or purpose, makes it likely to become energized.
As @Deltaforce and others have mentioned out its still covered under 250.4(A)(5)
 
See this article by Kieth Lofland

Here is an excerpt, notice the last four words in the last sentence

The bonding connection between the various components of the equipotential bonding grid can be made with a series of solid copper conductor(s) or with rigid metal conduit of brass or other identified corrosion-resistant metal. If a conductor is used, it may be insulated, covered, or bare, but cannot be smaller than 8 AWG. This bonding conductor is not required to be extended or attached to remote panelboards, service equipment, or any grounding electrodes. This bonding conductor is, again, simply for bonding of metal components together, it is not intended for establishing a connection to earth or a ground-fault return path.
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