- Location
- New Jersey
- Occupation
- Journeyman Electrician
Yes, because the neutral will have the lowest resistance of any parallel path for the neutral current.-The utility neutral is the best return for any utility hot entering the building, which all electrical systems in the facility utilize for proper function.
The earth is a poor conductor and under normal conditions should never have a lower resistance than the neutral conductor.-The earth grounded reference usually a ground rod/s driven into the earth or a ufer type system connects to the utility neutral reference for no other purpose than to provide a path of least resistance in the event of a lighting strike surge or similar from the utilities or within the facility if present. Chances are the earth ground will have less resistance than the utility neutral at that given point of the building/utility supply.
If there is a metal water pipe with 10' or more of that water pipe in contact with the earth then it qualifies as a grounding electrode and must be used as one. The GEC connection must be within 5' of where it enters the structure. Not sure why California would have an exception to eliminate that but it is required by the NEC.-The bonding of the water system, usually within 10ft of entering the facility is also connected to the utility neutral reference of the main gear to protect and/or create a least resistive path back to the utility neutral/earth electrode reference in the event of a fault current accidently applied to the water system, the same goes for the gas and metal building structure.
If the building supply water pipe in the ground is non-metallic or less than 10' in the earth then it is not an electrode and is not required to be used as one. However if the building uses a metal water pipe system then it needs to be bonded. That connection can be at any convenient point on the system. You're correct that bonding keeps the water piping system from possibly becoming energized. Gas piping systems other than some CSST brands do not require additional bonding.