Raised Cover Receptacles and Switches

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250.96 A seems to allow the cable sheath for an EGC.
250.97 A seems to allow the cable sheath for an EGC for circuits over 250volts.

What am I missing?

JAP>

For 250v and under I meant.

JAP>
250.96 is about bonding noncurrent-carrying-metal parts... not equipment grounding. To some, this sounds like both are the same. But Code distinguishes the subjects as different.
 
250.96 is about bonding noncurrent-carrying-metal parts... not equipment grounding. To some, this sounds like both are the same. But Code distinguishes the subjects as different.

That makes sense and where I got off.

In that case when using MC for a device in a metal box and cover and or a raised cover, the green EGC in the MC must bond to the box and jumper to the device in the cover, whereas if your using EMT the wire type EGC must bond to the box but the jumper to the device can be omitted.

I take back what I said earlier if that's the case.

I most always bond and jumper to the device so never dug that far into it.

JAP>
 
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